PCB Stackup Design for Modern Electronics

Authors : Jayasekar Micheal

Volume/Issue : Volume 8 - 2023, Issue 9 - September

Google Scholar : https://bit.ly/3TmGbDi

Scribd : https://tinyurl.com/vrt25p49

DOI : https://doi.org/10.5281/zenodo.8397973

Printed Circuit Boards (PCBs) Stackup is the arrangement of different layers to make up a PCB and it involves determining the number of layers, their order, and the materials used for each layer. The Stackup design plays an important role in the PCB design, as it directly impacts the performance, signal integrity, durability, reducing the electromagnetic emissions, and overall functionality of the electronic device. It is core related to the PCB Material and lamination process based on layer count, prepreg/Core material, thickness of each layer's, copper weight, via type, drilling type, layers ordering, and high-speed impedance control requirements. As modern AI/AR electronic products become more compact and complex, careful consideration of the PCB stackup becomes even more critical. In this article, we explore the key factors and strategies for optimizing PCB stackup to achieve enhanced signal integrity and performance.

Keywords : PCB Laminations, Copper Weight, Signal Layers, Lamination Materials, Power Plane, Strip Line, Micro-Strip Line, Impedance Control, EMI, EMC, Single Ply-Dual Ply, DK, TG, and CTE.


Paper Submission Last Date
31 - December - 2023

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